X-ışını denetim sistemleri

3D computed tomography detects BGA voiding and head-in-pillow defects. Resolution: 0.5μm voxel size. Automated defect classification (ADC) reduces analysis time by 70%. Tilted-view imaging reveals hidden solder joints. Radyasyon Güvenliği:<1μSv/hr leakage. Standards: IPC-7912 end-of-line criteria. High-throughput systems: 15 sec/board scan time.